By multiple confirmations appearing online, it seems Intel won’t ‘pack’ newer processor with a much awaited hbm memory or arc gpu unit for a long time. It could be that the heterogeneous packaging may be too expensive in terms of tdp or likely costs. Meanwhile AMD is preparing to release its first full 3D cpu in Q2 2022, called the 5800X3D.
Links
https://newsroom.intel.com/tag/foveros/
